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We stock and service Semiconductor Equipment C equipment, replacement parts and related systems - both current and discontinued products. Expedited shipping and repair services are available for your urgent requirements.

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1 results found for "Semiconductor Equipment C"
Part #
Manufacturer
Description Condition Units Available Price
410X Semiconductor Equipment C
Flip Chip Die Bonder. Aligns And Attaches Flip Chip Die Onto Various Substrates. Granite Table With Granite Risers. Alignment Accuracy Is +/- 5 Micron . Product Category: Semiconductor, Sub Category: Refurbished 1 Instant Quote