Get current pricing for Dynatex, DXB 52501 Dynatex Die Bonder Dxb Wafer Bonder Specifications Bonding Chamber Size Dxb-525-01 5.2 Inches (132 Mm) Temperature Range: 100-320° F (40-160 . Product Category: Semiconductor, Sub Category: Rapid Thermal Process:

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Manufacturer: Dynatex Part number: DXB 52501 Description: Dynatex Die Bonder Dxb Wafer Bonder Specifications Bonding Chamber Size Dxb-525-01 5.2 Inches (132 Mm) Temperature Range: 100-320° F (40-160 . Product Category: Semiconductor, Sub Category: Rapid Thermal Process

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Manufacturer: Dynatex Part number: DXB 52501 Description: Dynatex Die Bonder Dxb Wafer Bonder Specifications Bonding Chamber Size Dxb-525-01 5.2 Inches (132 Mm) Temperature Range: 100-320° F (40-160 . Product Category: Semiconductor, Sub Category: Rapid Thermal Process